Invention Grant
- Patent Title: Semiconductor component with transistor
- Patent Title (中): 具有晶体管的半导体元件
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Application No.: US14138266Application Date: 2013-12-23
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Publication No.: US09406673B2Publication Date: 2016-08-02
- Inventor: Gilberto Curatola , Oliver Haeberlen , Walter Rieger , Anthony Sanders
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/205 ; H01L29/778 ; H03K17/567 ; H01L29/20 ; H01L27/06 ; H01L29/417 ; H01L29/423

Abstract:
One aspect relates to a semiconductor component with a semiconductor body, a first main contact pad, a second main contact pad, a normally-on first transistor monolithically integrated in the semiconductor body and a normally-off second transistor monolithically integrated in the semiconductor body. The first transistor is a high electron mobility transistor having a first gate electrode and a first load path controllable via a first gate electrode, and the second transistor has a second gate electrode and a second load path controllable via the second gate electrode. The first load path and the second load path are electrically connected in series between the first main contact pad and the second main contact pad.
Public/Granted literature
- US20150179643A1 Semiconductor Component with Transistor Public/Granted day:2015-06-25
Information query
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