Invention Grant
- Patent Title: Semiconductor device having super-junction structures
- Patent Title (中): 具有超结结构的半导体器件
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Application No.: US14248979Application Date: 2014-04-09
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Publication No.: US09406742B2Publication Date: 2016-08-02
- Inventor: Tsung-Hsiung Lee , Jui-Chun Chang , Hsiung-Shih Chang
- Applicant: Vanguard International Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L23/58 ; H01L29/06 ; H01L29/66 ; H01L21/762 ; H01L29/78 ; H01L29/423 ; H01L29/786 ; H01L21/225 ; H01L21/265

Abstract:
A semiconductor device is disclosed. The device includes an epitaxial layer on a substrate, wherein the epitaxial layer includes first trenches and second trenches alternately arranged along a first direction. The epitaxial layer between the adjacent first and second trenches includes a first doping region and a second doping region, and the first doping region and the second doping region have different conductivity types. An interface is between the first doping region and the second doping region to form a super-junction structure. A gate structure is on the epitaxial layer. The epitaxial layer under the gate structure includes a channel extending along a second direction, and the first direction is perpendicular to the second direction.
Public/Granted literature
- US20150295024A1 SEMICONDUCTOR DEVICE HAVING SUPER-JUNCTION STRUCTURES AND FABRICATION THEREOF Public/Granted day:2015-10-15
Information query
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