Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
-
Application No.: US13371501Application Date: 2012-02-13
-
Publication No.: US09406794B2Publication Date: 2016-08-02
- Inventor: Naoki Izumi
- Applicant: Naoki Izumi
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2007-228033 20070903; JP2007-244410 20070920; JP2008-220163 20080828
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L21/336 ; H01L29/417 ; H01L29/423

Abstract:
A semiconductor device according to the present invention includes a semiconductor layer. A first conductivity type region is formed on a base layer portion of the semiconductor layer. A body region of a second conductivity type is formed on the semiconductor layer to be in contact with the first conductivity type region. A trench in which a gate electrode is embedded through a gate insulating film is formed on the semiconductor layer. The trench penetrates through the body region, so that a deepest portion thereof reaches the first conductivity type region. A source region of the first conductivity type is formed on a surface layer portion of the semiconductor layer around the trench. The gate insulating film includes a thick-film portion having a relatively large thickness on a bottom surface of the trench.
Public/Granted literature
- US20120146137A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2012-06-14
Information query
IPC分类: