Invention Grant
- Patent Title: Light emitting device manufacturing method and light emitting device
- Patent Title (中): 发光元件的制造方法和发光元件
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Application No.: US14478874Application Date: 2014-09-05
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Publication No.: US09406841B2Publication Date: 2016-08-02
- Inventor: Hideo Yamagishi , Akimine Hayashi
- Applicant: KANEKA CORPORATION
- Applicant Address: JP Osaka-shi
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka-shi
- Agency: Alleman Hall McCoy Russell & Tuttle LLP
- Priority: JP2012-050571 20120307
- Main IPC: H01L33/08
- IPC: H01L33/08 ; H01L27/32 ; H01L51/00 ; H01L51/50 ; C23C14/04

Abstract:
To improve efficiency when manufacturing a light emitting device formed using a mask to form regions corresponding to pixels on a substrate, provided is a method including, after forming a pattern on a substrate with a first light emitting material that emits light of a first spectrum, through a first opening and one or more second openings of a mask, moving the mask in a longitudinal direction of the first opening by a distance that is less than the width of the first opening in the longitudinal direction of the first opening and greater than or equal to the width of the one or more second openings in the longitudinal direction of the first opening, and then forming a pattern with a second light emitting material that emits light of a second spectrum, through the first opening and the one or more second openings of the mask.
Public/Granted literature
- US20140374781A1 LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE Public/Granted day:2014-12-25
Information query
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