Invention Grant
- Patent Title: Package for light emitting apparatus and light emitting apparatus including the same
- Patent Title (中): 发光装置的封装和包括该发光装置的发光装置
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Application No.: US14315332Application Date: 2014-06-26
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Publication No.: US09406856B2Publication Date: 2016-08-02
- Inventor: Shimpei Sasaoka , Takuya Nakabayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Mori & Ward, LLP
- Priority: JP2013-136421 20130628; JP2014-090906 20140425
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/62 ; H01L25/13 ; H01L33/48 ; H01L25/075

Abstract:
The present invention provides a package for light emitting apparatus has a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view, and includes first, second and third leadframes, and a resin portion. The first and second leadframes are arranged on the both sides in the long-length direction. The third leadframe is arranged between the first and second leadframes. The resin portion is integrally formed with the first, second and third leadframes. The first and second leadframes include main portions, and first and second extension portions that extend from the main portions toward the second and first leadframes, respectively, and have a width smaller than the main portions.
Public/Granted literature
- US20150001559A1 PACKAGE FOR LIGHT EMITTING APPARATUS AND LIGHT EMITTING APPARATUS INCLUDING THE SAME Public/Granted day:2015-01-01
Information query
IPC分类: