In an electronic device unit, each of the contact terminals includes a first member coupled to a press-fitting and fixing portion through intermediation of an elastically deformable portion, and a second member being coupled to the first member through intermediation of a folding portion and including a pressure bending portion formed at a terminal end of the second member. An end surface covering resin formed on the circuit board presses a pressure bending portion so that a conductive contact portion formed at the folding portion of the first member is pressed against the board-side terminal substantially in a right-angle direction. Thus, sliding contact between the conductive contact portion and the board-side terminal is diminished.