Invention Grant
- Patent Title: Interconnection systems
- Patent Title (中): 互连系统
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Application No.: US14159271Application Date: 2014-01-20
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Publication No.: US09407039B2Publication Date: 2016-08-02
- Inventor: Michael George , Jonathan J. Hubert , John S. Geldman
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01R13/64
- IPC: H01R13/64 ; H01R13/631
Abstract:
Interconnection systems are shown that include communication contacts, and a guide. Configurations are shown with a guide that locates a male portion with respect to a female portion and guides their engagement before any communication contacts are engaged. Configurations are also shown with a guide that includes one or more power contacts.
Public/Granted literature
- US20140148042A1 INTERCONNECTION SYSTEMS Public/Granted day:2014-05-29
Information query
