Invention Grant
- Patent Title: III-V lasers with integrated silicon photonic circuits
- Patent Title (中): 具有集成硅光子电路的III-V激光器
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Application No.: US13949973Application Date: 2013-07-24
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Publication No.: US09407066B2Publication Date: 2016-08-02
- Inventor: Cheng-Wei Cheng , Frank R. Libsch , Tak H. Ning , Uzma Rana , Kuen-Ting Shiu
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GlobalFoundries, Inc.
- Current Assignee: GlobalFoundries, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Michael Le Strange
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01S5/00 ; H01S5/227 ; H01S5/16 ; H01S5/02 ; H01S5/10

Abstract:
III-V lasers integrated with silicon photonic circuits and methods for making the same include a three-layer semiconductor stack formed from III-V semiconductors on a substrate, where a middle layer has a lower bandgap than a top layer and a bottom layer; a mirror region monolithically formed at a first end of the stack, configured to reflect emitted light in the direction of the stack; and a waveguide region monolithically formed at a second end of the stack, configured to transmit emitted light.
Public/Granted literature
- US20150030047A1 III-V LASERS WITH INTEGRATED SILICON PHOTONIC CIRCUITS Public/Granted day:2015-01-29
Information query
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