Invention Grant
- Patent Title: Radio frequency amplifying circuit and power amplifying module
- Patent Title (中): 射频放大电路和功率放大模块
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Application No.: US14205407Application Date: 2014-03-12
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Publication No.: US09407207B2Publication Date: 2016-08-02
- Inventor: Takayuki Tsutsui , Satoshi Tanaka , Kenichi Shimamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-057105 20130319; JP2013-238245 20131118
- Main IPC: H03F1/30
- IPC: H03F1/30 ; H03F1/02 ; H03F3/19 ; H03F3/21 ; H03F1/32 ; H03F1/56 ; H03F3/189 ; H03F3/24

Abstract:
An radio frequency amplifying circuit includes an amplifying transistor configured to amplify a radio frequency signal input to a base of the amplifying transistor via a matching network to output the amplified radio frequency signal, a first bias transistor connected to the amplifying transistor based on a current-mirror connection to supply a bias to the amplifying transistor, and a second bias transistor connected to the base of the amplifying transistor based on an emitter-follower connection to supply a bias to the amplifying transistor.
Public/Granted literature
- US20140285268A1 RADIO FREQUENCY AMPLIFYING CIRCUIT AND POWER AMPLIFYING MODULE Public/Granted day:2014-09-25
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