Invention Grant
- Patent Title: Microphone package with embedded ASIC
- Patent Title (中): 带嵌入式ASIC的麦克风包
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Application No.: US13272045Application Date: 2011-10-12
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Publication No.: US09407997B2Publication Date: 2016-08-02
- Inventor: Michael D. Delaus , Kathy O'Donnell , Thomas M. Goida
- Applicant: Michael D. Delaus , Kathy O'Donnell , Thomas M. Goida
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: IPxLaw Group LLP
- Agent Maryam Imam
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R19/00 ; B81C1/00 ; H04R19/04
Abstract:
A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.
Public/Granted literature
- US20120087521A1 Microphone Package with Embedded ASIC Public/Granted day:2012-04-12
Information query
