Invention Grant
US09408296B2 Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same
有权
树脂组合物，保护膜，干膜，电路板和含有它们的多层电路板
- Patent Title: Resin composition, and protective film, dry film, circuit board, and multilayer circuit board containing same
- Patent Title (中): 树脂组合物，保护膜，干膜，电路板和含有它们的多层电路板
-
Application No.: US13976630Application Date: 2011-12-26
-
Publication No.: US09408296B2Publication Date: 2016-08-02
- Inventor: Shuji Tahara , Kiyomi Yasuda
- Applicant: Shuji Tahara , Kiyomi Yasuda
- Applicant Address: JP Tokyo
- Assignee: Mitsui Chemicals Tohcello, Inc.
- Current Assignee: Mitsui Chemicals Tohcello, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2010-292622 20101228
- International Application: PCT/JP2011/007277 WO 20111226
- International Announcement: WO2012/090476 WO 20120705
- Main IPC: H05K1/02
- IPC: H05K1/02 ; C08L79/04 ; H05K1/03 ; H05K3/28 ; C08G18/28 ; C08G18/76 ; C08G18/80 ; C08G18/00 ; H05K3/46
Abstract:
A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×104 or more.
Public/Granted literature
Information query
