A packaging substrate is provided, including a substrate body and conductive pillars. The substrate body has a first surface and a second surface opposite to the first surface. The first surface has a plurality of first conductive pads, and the second surface has a die attach area and a peripheral area surrounding the die attach area. The die attach area has a plurality of second conductive pads embedded therein, wherein top surfaces of the second conductive pads are exposed from the second surface, and the die attach area of the second surface is fully exposed. The conductive pillars are correspondingly disposed on the second conductive pads and have first ends and opposite second ends. The first ends are closer than the second ends from the second conductive pads, and the first ends have a width bigger than a width of the second ends. A fabricating method thereof is also provided.