Invention Grant
- Patent Title: Treating cartilage defect with UCB-MSC expressing TSP-2
- Patent Title (中): 用表达TSP-2的UCB-MSC处理软骨缺损
-
Application No.: US13921857Application Date: 2013-06-19
-
Publication No.: US09408892B2Publication Date: 2016-08-09
- Inventor: Yoon-Sun Yang , Won Il Oh , Hong Bae Jeon , Mee Hyun Jung , Sang Young Jeong
- Applicant: MEDIPOST CO., LTD.
- Applicant Address: KR Seoul
- Assignee: MEDIPOST CO., LTD
- Current Assignee: MEDIPOST CO., LTD
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Main IPC: C12N5/00
- IPC: C12N5/00 ; A61K38/17 ; A61K38/39 ; G01N33/50 ; A61K38/18
Abstract:
Thrombospondin 1 (TSP-1), TSP-2, interleukin 17B receptor (IL-17BR) and heparin-binding epidermal growth factor-like growth factor (HB-EGF) associated with stem cell activity and use thereof.
Public/Granted literature
- US20140303087A1 TSP-1, TSP-2, IL-17BR AND HB-EGF ASSOCIATED WITH STEM CELL ACTIVITY AND USE THEREOF Public/Granted day:2014-10-09
Information query
