Invention Grant
- Patent Title: Fabrication method of microfluidic devices
- Patent Title (中): 微流体装置的制造方法
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Application No.: US13808853Application Date: 2011-04-25
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Publication No.: US09409167B2Publication Date: 2016-08-09
- Inventor: Florian Laouenan , Inigo Aranburu , Maria Agirregabiria , Jorge Elizalde , Javier Berganzo , Jesus Ruano , Luis J. Fernandez , Aitor Ezkerra
- Applicant: Florian Laouenan , Inigo Aranburu , Maria Agirregabiria , Jorge Elizalde , Javier Berganzo , Jesus Ruano , Luis J. Fernandez , Aitor Ezkerra
- Applicant Address: ES Mondragon, Guipuzcoa
- Assignee: IKERLAN, S.COOP
- Current Assignee: IKERLAN, S.COOP
- Current Assignee Address: ES Mondragon, Guipuzcoa
- Agency: Merchant & Gould P.C.
- International Application: PCT/ES2011/070291 WO 20110425
- International Announcement: WO2012/004432 WO 20120112
- Main IPC: B29C65/02
- IPC: B29C65/02 ; B29C65/76 ; B32B37/10 ; B32B38/10 ; C09J5/02 ; C08J5/00 ; B01L3/00 ; B29C65/00 ; B81C3/00 ; F16K99/00 ; B29L31/00

Abstract:
Fabrication method of microfluidic devices consisting of a sheet (1) which is 200 micrometer thick or less and a rigid part (3), both made of thermoplastic polymeric material includes degasification of a polymeric sheet of thermoplastic material (1), an auxiliary rigid part (2), and a polymeric rigid part of thermoplastic material (3). A temporary bonding procedure, of the degassed thermoplastic polymeric sheet (1) to a degassed auxiliary rigid part (2), is conducted producing a sheet-auxiliary part set (4). A permanent bonding procedure bonds the thermoplastic polymeric sheet (1) of the sheet-auxiliary part set (4) obtained in the previous temporary bonding stage, to the thermoplastic polymeric rigid part (3) which was initially degassed. The auxiliary rigid part (2) of the thermoplastic polymeric sheet (1) permanently bonded to the thermoplastic rigid part (3), is detached to produce a final part which is completely polymeric (5).
Public/Granted literature
- US20140102636A1 FABRICATION METHOD OF MICROFLUIDIC DEVICES Public/Granted day:2014-04-17
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