Invention Grant
US09409207B2 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
有权
超声波设备,超声波探头,电子设备和超声波成像设备
- Patent Title: Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic imaging apparatus
- Patent Title (中): 超声波设备,超声波探头,电子设备和超声波成像设备
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Application No.: US14164680Application Date: 2014-01-27
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Publication No.: US09409207B2Publication Date: 2016-08-09
- Inventor: Yasunori Onishi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2013-012946 20130128
- Main IPC: B06B3/04
- IPC: B06B3/04 ; B06B1/06 ; G01N29/06 ; B06B3/00 ; G10K11/30

Abstract:
Provided is an ultrasonic device including: an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body; an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate; and a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate. The above-described ultrasonic device further includes an acoustic matching layer filled between the ultrasonic element array substrate and the acoustic lens.
Public/Granted literature
- US20140208853A1 ULTRASONIC DEVICE, ULTRASONIC PROBE, ELECTRONIC EQUIPMENT, AND ULTRASONIC IMAGING APPARATUS Public/Granted day:2014-07-31
Information query
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