Invention Grant
- Patent Title: Method and device for applying a sealing compound to a surface
- Patent Title (中): 将密封剂施加到表面的方法和装置
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Application No.: US13391969Application Date: 2010-08-27
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Publication No.: US09409324B2Publication Date: 2016-08-09
- Inventor: Thomas Haar
- Applicant: Thomas Haar
- Applicant Address: DE Wedel
- Assignee: SAETA GMBH & CO. KG
- Current Assignee: SAETA GMBH & CO. KG
- Current Assignee Address: DE Wedel
- Agency: Vidas, Arrett & Steinkraus, P.A.
- Priority: DE102009040802 20090828
- International Application: PCT/EP2010/005276 WO 20100827
- International Announcement: WO2011/023399 WO 20110303
- Main IPC: B29C31/00
- IPC: B29C31/00 ; B29C43/18 ; B05D1/26 ; B05C1/02 ; B05D1/28 ; B05D3/12 ; B29C31/04 ; B29C43/34 ; B29C43/36 ; B29L31/56

Abstract:
A device for applying a sealing compound into a closure cap for containers comprising: an outer stamp (18) and a concentric inner stamp (14), the stamps being movable with respect to each other, an annular gap (26) between the stamps (14, 18), which is open towards the outside or the inside and of which at least one section is variable between an initial gap width and a gap width zero in the movement direction of the stamps in an axial relative movement of the stamps (14, 18), a feeding system for plasticized sealing compound within a stamp, which is connected to the annular gap (26), a mechanism that prevent any reflux of the melt from the annular gap, and adjustment mechanism for at least one of the stamps for changing the gap width of the annular gap.
Public/Granted literature
- US20120171381A1 Method and Device for Applying a Sealing Compound to a Surface Public/Granted day:2012-07-05
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