Invention Grant
- Patent Title: Grain bin sensor cable forming method
- Patent Title (中): 谷壳传感器电缆成型方法
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Application No.: US13791917Application Date: 2013-03-09
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Publication No.: US09409327B2Publication Date: 2016-08-09
- Inventor: Brent J. Bloemendaal
- Applicant: CTB, Inc.
- Applicant Address: US IN Milford
- Assignee: CTB, Inc.
- Current Assignee: CTB, Inc.
- Current Assignee Address: US IN Milford
- Agency: Harness, Dickey
- Main IPC: B29C43/52
- IPC: B29C43/52 ; B29C43/18 ; B29L31/00 ; B29L31/34

Abstract:
A method and apparatus for forming a grain bin sensor cable including a plurality of mold members defining a mold cavity. A pre-formed cable with wires disposed therein is placed into the mold cavity, heated, and formed into a post-formed cable. The post-formed cable includes a recessed portion and a pair of end caps. Apertures are created within the recessed portion so as to expose a portion of the wires. The end caps are generally cone-shaped and include vertical walls. The post-formed cable is removed from the mold cavity and a sensor package is coupled to the wires exposed in the recessed portion and captured between the vertical walls of the end caps. A housing is coupled about the sensor package.
Public/Granted literature
- US20140252678A1 GRAIN BIN SENSOR CABLE FORMING METHOD AND APPARATUS Public/Granted day:2014-09-11
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