Invention Grant
US09409335B1 Computer-implemented simulation method and non-transitory computer medium for use in molding process
有权
计算机实现的模拟方法和非瞬态计算机介质,用于成型过程
- Patent Title: Computer-implemented simulation method and non-transitory computer medium for use in molding process
- Patent Title (中): 计算机实现的模拟方法和非瞬态计算机介质,用于成型过程
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Application No.: US14871916Application Date: 2015-09-30
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Publication No.: US09409335B1Publication Date: 2016-08-09
- Inventor: Tung Huan Su , Hsien Sen Chiu , Rong Yeu Chang , Chia Hsiang Hsu , Ching Chang Chien , Chih Chung Hsu
- Applicant: CORETECH SYSTEM CO., LTD.
- Applicant Address: TW Hsinchu County
- Assignee: CORETECH SYSTEM CO., LTD.
- Current Assignee: CORETECH SYSTEM CO., LTD.
- Current Assignee Address: TW Hsinchu County
- Agency: WPAT, P.C., International Property Attorneys
- Agent Anthony King
- Main IPC: B29C45/78
- IPC: B29C45/78 ; G05B17/02

Abstract:
A molding method includes the steps of specifying a simulating domain having a resin part and a mold part, wherein the simulating domain corresponds to a genuine domain on a molding machine; setting an initial resin temperature of the resin part and an initial mold temperature of the mold part; performing a transient state analysis to calculate a plurality of temperature distributions at different times between the resin part and the mold part; calculating at least one heat transfer coefficient between the resin part and the mold part taking into consideration the plurality of temperature distributions at different times; simulating the molding process of a molding resin that is injected into the simulating domain by using the at least one heat transfer coefficient to generate a plurality of molding conditions; and performing the molding process by using the plurality of molding conditions to the genuine domain on the molding machine.
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