Invention Grant
- Patent Title: Mold, molding jig and molding method
- Patent Title (中): 模具，成型夹具和成型方法
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Application No.: US13976732Application Date: 2011-12-26
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Publication No.: US09409361B2Publication Date: 2016-08-09
- Inventor: Toshikazu Sana , Akihito Sakai , Akira Murai , Yasuhiro Takenaka , Kazuyoshi Kawano , Tomoya Takahashi
- Applicant: Toshikazu Sana , Akihito Sakai , Akira Murai , Yasuhiro Takenaka , Kazuyoshi Kawano , Tomoya Takahashi
- Applicant Address: JP Hyogo
- Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
- Current Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Hyogo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-290401 20101227
- International Application: PCT/JP2011/007255 WO 20111226
- International Announcement: WO2012/090468 WO 20120705
- Main IPC: B29C43/36
- IPC: B29C43/36 ; B29C70/32 ; B29D99/00 ; B29C33/00 ; B29C70/54 ; B64F5/00
Abstract:
A mold (10) according to the present invention is a mold for molding a surface of a laminate (60) when curing the laminate (60) obtained by laminating prepreg (62). The mold (10) has a planar plate shape and elastically deforms from the planar plate shape into a shape corresponding to a shape of the laminate (60), thereby being capable of coming tight into contact with the laminate (60). Thereby, a mold which is easy to handle can be provided.
Public/Granted literature
- US20140008009A1 MOLD, MOLDING JIG AND MOLDING METHOD Public/Granted day:2014-01-09
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