Invention Grant
US09409379B2 Method and apparatus for bonding metals and composites 有权
用于接合金属和复合材料的方法和设备

Method and apparatus for bonding metals and composites
Abstract:
Apparatus, systems and methods for forming a structure that includes a metal and a composite material are disclosed. According to one aspect, a layer stack includes a metal layer with a first surface, the first surface including at least one protruding feature. The layer stack also includes a non-metal layer molded to the first surface of the metal layer, wherein the non-metal layer is molded over and/or around the at least one protruding feature.
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