Invention Grant
- Patent Title: Method and apparatus for bonding metals and composites
- Patent Title (中): 用于接合金属和复合材料的方法和设备
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Application No.: US14133439Application Date: 2013-12-18
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Publication No.: US09409379B2Publication Date: 2016-08-09
- Inventor: Stephen Brian Lynch
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: B32B7/04
- IPC: B32B7/04 ; B23K31/02 ; B32B3/30 ; H05K1/00 ; H05K1/11 ; H05K7/00 ; B32B3/06

Abstract:
Apparatus, systems and methods for forming a structure that includes a metal and a composite material are disclosed. According to one aspect, a layer stack includes a metal layer with a first surface, the first surface including at least one protruding feature. The layer stack also includes a non-metal layer molded to the first surface of the metal layer, wherein the non-metal layer is molded over and/or around the at least one protruding feature.
Public/Granted literature
- US20140106178A1 Method and Apparatus for Bonding Metals and Composites Public/Granted day:2014-04-17
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