Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US14213883Application Date: 2014-03-14
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Publication No.: US09409392B2Publication Date: 2016-08-09
- Inventor: Shunsuke Watanabe , Katsumi Enomoto , Ryota Kinoshita , Hiroyuki Ishii , Hiroshige Owaki , Takahiro Kanegae , Katsuhiro Okubo
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2013-067435 20130327
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A wall-shaped enclosure that forms a space which can accommodate a head chip is formed in a projecting manner at a lower end of a lower case member. Since a cylindrical thick part is formed at the lower end of the lower case member, the lower case member is unlikely to be bent, particularly around the wall-shaped enclosure and a part where the wall-shaped enclosure is disposed. The head chip that is disposed in the space of the lower case member which is unlikely to be bent is unlikely to be subjected to an external force, and the cover member absorbs torsion generated between the head chip and the lower case member so that the head chip is even more unlikely to be subjected to the external force.
Public/Granted literature
- US20140292931A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2014-10-02
Information query
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