Invention Grant
- Patent Title: MEMS package structure and manufacturing method thereof
- Patent Title (中): MEMS封装结构及其制造方法
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Application No.: US14743678Application Date: 2015-06-18
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Publication No.: US09409766B2Publication Date: 2016-08-09
- Inventor: Tung-Feng Wu , Wei-Hsiao Chen , Chun-Hao Su , Jui-Wen Chen , Mao-Chien Cheng
- Applicant: Himax Display, Inc.
- Applicant Address: TW Tainan
- Assignee: Himax Display, Inc.
- Current Assignee: Himax Display, Inc.
- Current Assignee Address: TW Tainan
- Agency: J.C. Patents
- Main IPC: H01L23/02
- IPC: H01L23/02 ; B81B7/00 ; B81C1/00 ; G02B27/00 ; G02B26/08
Abstract:
A MEMS package structure includes a base, a MEMS device, a first cover, a second cover and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covering the MEMS device. The second cover is disposed on the base and covering the recess. The glass frit is disposed between the base and the second cover. A MEMS package structure includes the base, the MEMS device, the first cover, a second cover, a first metal frame and a first sealing medium. The first metal frame is disposed around the second cover, and the second cover and the first metal frame collectively are disposed on the base and covering the recess. The first sealing medium is disposed between the first metal frame and the base. Manufacturing methods of the MEMS package structures above are further provided.
Public/Granted literature
- US20150284241A1 MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-10-08
Information query
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