Invention Grant
- Patent Title: MEMS device with integrated temperature stabilization
- Patent Title (中): 具有集成温度稳定性的MEMS器件
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Application No.: US14065310Application Date: 2013-10-28
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Publication No.: US09409768B2Publication Date: 2016-08-09
- Inventor: Jeffrey F. DeNatale , Philip A. Stupar
- Applicant: Teledyne Scientific & Imaging, LLC
- Applicant Address: US CA Thousand Oaks
- Assignee: Teledyne Scientific & Imaging, LLC
- Current Assignee: Teledyne Scientific & Imaging, LLC
- Current Assignee Address: US CA Thousand Oaks
- Agency: Snell & Wilmer LLP
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B81C1/00 ; G01C19/5712

Abstract:
An apparatus for providing localized heating as well as protection for a vibrating MEMS device. A cap over a MEMS gyroscope includes an embedded temperature sensor and a heater. The temperature sensor is a trace made of a material with a known temperature/resistance coefficient, which loops back along itself to reduce electromagnetic interference. The heater is a resistive metal trace which also loops back along itself. The temperature sensor and the heater provide localized temperature stabilization for the MEMS gyroscope to reduce temperature drift in the MEMS gyroscope.
Public/Granted literature
- US20150115377A1 MEMS DEVICE WITH INTEGRATED TEMPERATURE STABILIZATION Public/Granted day:2015-04-30
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