Invention Grant
US09410017B2 Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board
有权
聚酰胺酸，感光树脂组合物，干膜和电路板
- Patent Title: Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board
- Patent Title (中): 聚酰胺酸，感光树脂组合物，干膜和电路板
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Application No.: US14115201Application Date: 2013-05-03
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Publication No.: US09410017B2Publication Date: 2016-08-09
- Inventor: Jung-Hak Kim , You-Jin Kyung , Hee-Jung Kim , Kwang-Joo Lee
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2012-0046942 20120503; KR10-2013-0049734 20130503
- International Application: PCT/KR2013/003864 WO 20130503
- International Announcement: WO2013/165211 WO 20131107
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; B29C71/04 ; C08G61/04 ; C08G73/10 ; H05K3/28 ; G03F7/037 ; G03F7/038 ; G03F7/40
Abstract:
The present invention relates to a novel polyamic acid introduced with an imidazolyl group in the polymer chain, a photosensitive resin composition including the polyamic acid and that is capable of providing a photosensitive material that satisfies the characteristics of an excellent bending property and low stiffness and also exhibits excellent heat resistance and coating resistance, a dry film obtained from the photosensitive resin composition, and a circuit board including the dry film.
Public/Granted literature
- US20140296362A1 NEW POLY-AMIC ACID, PHOTO-SENSITIVE RESIN COMPOSITION, DRY FILM, AND CIRCUIT BOARD Public/Granted day:2014-10-02
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