Invention Grant
- Patent Title: Method for separating surface layer or growth layer of diamond
- Patent Title (中): 分离金刚石表面层或生长层的方法
-
Application No.: US12439887Application Date: 2007-08-31
-
Publication No.: US09410241B2Publication Date: 2016-08-09
- Inventor: Yoshiaki Mokuno , Akiyoshi Chayahara , Hideaki Yamada
- Applicant: Yoshiaki Mokuno , Akiyoshi Chayahara , Hideaki Yamada
- Applicant Address: JP Tokyo
- Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2006-238402 20060904
- International Application: PCT/JP2007/067023 WO 20070831
- International Announcement: WO2008/029736 WO 20080313
- Main IPC: C23C16/01
- IPC: C23C16/01 ; C23C16/27 ; C23C16/56 ; C25F3/00 ; C30B29/04 ; C30B31/22 ; C30B33/06

Abstract:
The present invention provides a method for separating a surface layer of a diamond, which comprises implanting ions into a diamond to form a non-diamond layer near a surface of the diamond; and etching the non-diamond layer in the diamond by applying an alternating-current voltage across electrodes in an electrolytic solution; and a method for separating a grown layer of a diamond, which further comprises the step of growing a diamond by a vapor-phase synthesis method, after forming a non-diamond layer according to the above-described method. The invention is applicable to various single-crystal and polycrystal diamonds. More specifically, even with a large single-crystal diamond, a portion of the single-crystal diamond can be efficiently separated in a reusable form in a relatively short period of time.
Public/Granted literature
- US20100206217A1 METHOD FOR SEPARATING SURFACE LAYER OR GROWTH LAYER OF DIAMOND Public/Granted day:2010-08-19
Information query
IPC分类: