Invention Grant
US09410856B2 Sensor device, sensor module, force detection device, and robot
有权
传感器装置，传感器模块，力检测装置和机器人
- Patent Title: Sensor device, sensor module, force detection device, and robot
- Patent Title (中): 传感器装置，传感器模块，力检测装置和机器人
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Application No.: US13967575Application Date: 2013-08-15
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Publication No.: US09410856B2Publication Date: 2016-08-09
- Inventor: Toshiyuki Kamiya , Hiroki Kawai
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-182987 20120822
- Main IPC: G01L1/16
- IPC: G01L1/16 ; G01L5/16
Abstract:
A package having a recessed section, a sensor element arranged in the recessed section and having a piezoelectric material, a lid joined to the package and sealing the recessed section of the package are provided. The package has a first hollow portion which a part of the sensor element fits with, on an inner bottom surface of the recessed section. The lid has a second hollow portion which a part of the sensor element fits with.
Public/Granted literature
- US20140053660A1 SENSOR DEVICE, SENSOR MODULE, FORCE DETECTION DEVICE, AND ROBOT Public/Granted day:2014-02-27
Information query
