Invention Grant
- Patent Title: Bio-chip package with waveguide integrated spectrometer
- Patent Title (中): 带波导集成光谱仪的生物芯片封装
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Application No.: US14087010Application Date: 2013-11-22
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Publication No.: US09410893B2Publication Date: 2016-08-09
- Inventor: Jui Hsieh Lai , Ying-Hao Kuo
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: G01N21/77
- IPC: G01N21/77 ; G01N21/03

Abstract:
A bio-chip package comprises a substrate a first layer over the substrate comprising an image sensor. The bio-chip package also comprises a second layer over the first layer. The second layer comprises a waveguide system a grating coupler. The bio-chip package also comprises a third layer arranged to accommodate a fluid between a first-third layer portion and a second-third layer portion, and to allow the fluid to pass from a first side of the third layer to a second side of the third layer. The third layer comprises a material having a predetermined transparency with respect to a wavelength of a received source light, the waveguide system is configured to direct the received source light to the grating coupler, and the image sensor is configured to determine a change in the wavelength of the source light caused by a coupling between the source light and the fluid.
Public/Granted literature
- US20150146203A1 BIO-CHIP PACKAGE WITH WAVEGUIDE INTEGRATED SPECTROMETER Public/Granted day:2015-05-28
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