Invention Grant
- Patent Title: System and method for statistical post-silicon validation
- Patent Title (中): 统计后硅验证的系统和方法
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Application No.: US13663258Application Date: 2012-10-29
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Publication No.: US09411007B2Publication Date: 2016-08-09
- Inventor: Valeria Bertacco , Andrew DeOrio , Daya Shanker Khudia
- Applicant: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Applicant Address: US MI Ann Arbor
- Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
- Current Assignee Address: US MI Ann Arbor
- Agency: Marshall, Gerstein & Borun LLP
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R29/26 ; G01R27/28 ; G06F11/263 ; G01R31/3183 ; G06F11/26 ; G01R31/3185

Abstract:
The system and method described herein relate to a bug positioning system for post-silicon validation of a prototype integrated circuit using statistical analysis. Specifically, the bug positioning system samples output and intermediate signals from a prototype chip to generate signatures. Signatures are grouped into passing and failing groups, modeled, and compared to identify patterns of acceptable behavior and unacceptable behavior and locate bugs in space and time.
Public/Granted literature
- US20150268293A1 System and Method for Statistical Post-Silicon Validation Public/Granted day:2015-09-24
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