Invention Grant
- Patent Title: Negative photosensitive resin composition and cured product of same
- Patent Title (中): 负型感光性树脂组合物及其固化物
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Application No.: US14124474Application Date: 2012-06-19
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Publication No.: US09411229B2Publication Date: 2016-08-09
- Inventor: Shinya Inagaki , Nao Honda , Naoko Imaizumi , Misato Oonishi
- Applicant: Shinya Inagaki , Nao Honda , Naoko Imaizumi , Misato Oonishi
- Applicant Address: JP Tokyo
- Assignee: Nippon Kayaku Kabushiki Kaisha
- Current Assignee: Nippon Kayaku Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Nields, Lemack & Frame, LLC
- Priority: JP2011-136179 20110620
- International Application: PCT/JP2012/065567 WO 20120619
- International Announcement: WO2012/176750 WO 20121227
- Main IPC: G03F7/038
- IPC: G03F7/038 ; C08G59/06 ; C08G59/32 ; C08G59/42 ; C08L63/00
Abstract:
A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.
Public/Granted literature
- US20140099581A1 Negative Photosensitive Resin Composition And Cured Product Of Same Public/Granted day:2014-04-10
Information query
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