Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13739674Application Date: 2013-01-11
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Publication No.: US09411758B2Publication Date: 2016-08-09
- Inventor: Hajime Yamashita
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Foley & Lardner LLP
- Priority: JP2012-005176 20120113
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F13/40 ; G06F1/32 ; G06F13/364 ; G06F1/00

Abstract:
A semiconductor device according to the present invention includes a first module that issues a first transaction from a first interface unit to be a bus master, a second module that includes a second interface unit to be a bus slave and a third interface unit to be a bus master, and issues a second transaction in response to the first transaction, a third module that receives the second transaction by a fourth interface unit to be a bus slave, a bus master stop request control unit that asserts a bus master stop request and completes an assertion process in response to assertion of a bus master stop acknowledgement, and a code addition unit that adds to the first transaction a compulsory process request code for forcing issuance of the second transaction regardless of the bus master stop request.
Public/Granted literature
- US20130185468A1 SEMICONDUCTOR DEVICE Public/Granted day:2013-07-18
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