Invention Grant
- Patent Title: Ion implantation method and ion implantation apparatus
- Patent Title (中): 离子注入法和离子注入装置
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Application No.: US14696060Application Date: 2015-04-24
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Publication No.: US09412561B2Publication Date: 2016-08-09
- Inventor: Takeshi Kurose , Noriyasu Ido , Hiroyuki Kariya
- Applicant: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Current Assignee: Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2014-091762 20140425
- Main IPC: G01R31/26
- IPC: G01R31/26 ; H01J37/304 ; H01J37/30 ; H01J37/317

Abstract:
An ion implantation apparatus includes a beam scanner, a beam measurement unit that is able to measure an ion irradiation amount distribution in a beam scanning direction at a wafer position, and a control unit that outputs a control waveform to the beam scanner for scanning an ion beam. The control unit includes an output unit that outputs a reference control waveform to the beam scanner, an acquisition unit that acquires the ion irradiation amount distribution measured for the ion beam scanned based on the reference control waveform from a beam measurement unit, and a generation unit that generates a correction control waveform by using the acquired ion irradiation amount distribution. The control unit outputs the correction control waveform so that the ion irradiation amount distribution becomes a target distribution and the ion irradiation amount distribution per unit time becomes a target value.
Public/Granted literature
- US20150311077A1 ION IMPLANTATION METHOD AND ION IMPLANTATION APPARATUS Public/Granted day:2015-10-29
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