Invention Grant
- Patent Title: Systems and methods for intelligent dispatching for wafer processing
- Patent Title (中): 用于晶圆处理的智能调度系统和方法
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Application No.: US14132362Application Date: 2013-12-18
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Publication No.: US09412595B2Publication Date: 2016-08-09
- Inventor: Kuo-Yuan Ho , Li-Jen Chen , Chih-Cheng Kao , Shih-Ting Zeng , Yi-Hsiung Lin
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01J37/317
- IPC: H01J37/317 ; G05B19/00 ; H01L21/265
Abstract:
Systems and methods are provided for ion implantation. For example, ion implantation is performed using a first ion implant tool. At least one condition parameter associated with the first ion implant tool is dynamically obtained. Whether the first ion implant tool is in a first condition is determined based on the at least one condition parameter. Ion implantation is performed using a second ion implant tool based on the determination.
Public/Granted literature
- US20150170917A1 SYSTEMS AND METHODS FOR INTELLIGENT DISPATCHING FOR WAFER PROCESSING Public/Granted day:2015-06-18
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