Invention Grant
- Patent Title: Methods for processing substrates
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Application No.: US14682231Application Date: 2015-04-09
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Publication No.: US09412636B2Publication Date: 2016-08-09
- Inventor: Chungsun Lee , Jung-Seok Ahn , Kwang-chul Choi , Un-Byoung Kang , Jung-Hwan Kim , Joonsik Sohn , Jeon Il Lee
- Applicant: Samsung Electronics Co., Ltd
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0008692 20130125
- Main IPC: H01L21/58
- IPC: H01L21/58 ; H01L21/683 ; H01L21/304 ; B32B37/12 ; B32B37/18 ; B32B37/24 ; B32B37/26 ; B32B38/04 ; B32B38/10 ; B32B38/16 ; H01L21/02 ; H01L21/768 ; H01L23/00
Abstract:
A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.
Public/Granted literature
- US20150214089A1 METHODS FOR PROCESSING SUBSTRATES Public/Granted day:2015-07-30
Information query
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