Invention Grant
- Patent Title: Short circuit reduction in a ferroelectric memory cell comprising a stack of layers arranged on a flexible substrate
- Patent Title (中): 包括布置在柔性基板上的一叠层的铁电存储单元的短路减少
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Application No.: US14128011Application Date: 2011-06-27
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Publication No.: US09412705B2Publication Date: 2016-08-09
- Inventor: Christer Karlsson , Olle Jonny Hagel , Jakob Nilsson , Per Bröms
- Applicant: Christer Karlsson , Olle Jonny Hagel , Jakob Nilsson , Per Bröms
- Applicant Address: NO Oslo
- Assignee: Thin Film Electronics ASA
- Current Assignee: Thin Film Electronics ASA
- Current Assignee Address: NO Oslo
- Agency: Moore & Van Allen PLLC
- Agent Steven B. Phillips
- International Application: PCT/EP2011/060740 WO 20110627
- International Announcement: WO2013/000501 WO 20130103
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G11B9/02 ; H01L27/115 ; H01L51/05 ; H01L27/12 ; H01L49/02 ; G11C11/16 ; H01L43/02 ; H01L43/12 ; G11C11/22

Abstract:
A ferroelectric memory cell (1) and a memory device (100) comprising one or more such cells (1). The ferroelectric memory cell comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one ferroelectric memory material layer (7) between said electrodes. The stack further comprises a buffer layer (13) arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.
Public/Granted literature
Information query
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