Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14677396Application Date: 2015-04-02
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Publication No.: US09412738B2Publication Date: 2016-08-09
- Inventor: Tomoyuki Furuhata
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-078333 20140407
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L27/088 ; H01L29/78 ; H01L29/36 ; H01L29/06 ; H01L21/8238 ; H01L27/092 ; H01L21/8234

Abstract:
A semiconductor device includes a semiconductor substrate of a first conductivity type, an impurity layer of a second conductivity type provided within the semiconductor substrate, an impurity region of the second conductivity type that is connected, within the semiconductor substrate, to the impurity layer, and separates a first region of the semiconductor substrate from a second region by surrounding the first region of the semiconductor substrate together with the impurity layer, a first well and second well of the second conductivity type that are provided on the impurity layer via at least a semiconductor layer of the first conductivity type, and a plurality of transistors provided to the semiconductor substrate.
Public/Granted literature
- US20150287719A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-10-08
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