Invention Grant
US09412817B2 Silicide regions in vertical gate all around (VGAA) devices and methods of forming same
有权
垂直门四周(VGAA)设备的硅化物区域及其形成方法
- Patent Title: Silicide regions in vertical gate all around (VGAA) devices and methods of forming same
- Patent Title (中): 垂直门四周(VGAA)设备的硅化物区域及其形成方法
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Application No.: US14577699Application Date: 2014-12-19
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Publication No.: US09412817B2Publication Date: 2016-08-09
- Inventor: Kai-Chieh Yang , Wai-Yi Lien
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/45 ; H01L29/417 ; H01L29/423 ; H01L29/78

Abstract:
An embodiment semiconductor device includes a nanowire extending upwards from a semiconductor substrate, a source/drain region in the nanowire, and a channel region in the nanowire over the source/drain region. The source/drain region further extends into the semiconductor substrate past edges of the nanowire. The semiconductor device further includes a gate structure encircling the channel region and a silicide in an upper portion of the source/drain region. A sidewall of the silicide is aligned with a sidewall of the gate structure.
Public/Granted literature
- US20160181362A1 Silicide Regions in Vertical Gate All Around (VGAA) Devices and Methods of Forming Same Public/Granted day:2016-06-23
Information query
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