Invention Grant
- Patent Title: Light emitting apparatus, manufacturing method of light emitting apparatus, light receiving and emitting apparatus, and electronic equipment
- Patent Title (中): 发光装置，发光装置的制造方法，光接收和发射装置和电子设备
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Application No.: US14859490Application Date: 2015-09-21
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Publication No.: US09412909B2Publication Date: 2016-08-09
- Inventor: Tetsuji Fujita , Hidetoshi Yamamoto , Hideto Ishiguro , Tsukasa Eguchi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2013-148276 20130717; JP2014-084339 20140416
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/40 ; H01L31/16 ; H01L31/18 ; G06K9/00 ; H01L33/00 ; H01L33/42
Abstract:
A manufacturing method is a method for manufacturing a light emitting apparatus including a translucent substrate, and a light emitting section and an optical filer section that are arranged in a first region of the substrate when viewed in a normal direction of a first surface of the substrate. The manufacturing method includes: forming a dielectric multilayer film over the first region of the substrate; forming a first electrode on the dielectric multilayer film included in the light emitting section; forming a functional layer with a light emitting layer over the first electrode and the dielectric multilayer film included in the optical filter section; and forming a second electrode having semi-transmissive reflectivity on the functional layer over the first region of the substrate.
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