Invention Grant
- Patent Title: Method for transferring light-emitting elements onto a package substrate
- Patent Title (中): 将发光元件转印到封装衬底上的方法
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Application No.: US14952227Application Date: 2015-11-25
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Publication No.: US09412912B2Publication Date: 2016-08-09
- Inventor: Ching-Liang Lin , Yu-Hung Lai , Tzu-Yang Lin , Pei-Hsin Chen
- Applicant: PLAYNITRIDE INC.
- Applicant Address: TW Tainan
- Assignee: Playnitride, Inc.
- Current Assignee: Playnitride, Inc.
- Current Assignee Address: TW Tainan
- Agency: LeClairRyan
- Priority: TW103141778A 20141202
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/48 ; H01L23/00 ; H01L25/075 ; H01L33/62 ; H01L25/00

Abstract:
A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a temporary substrate and light-emitting elements; disconnecting the light-emitting elements from the temporary substrate to allow the light-emitting elements to float on a fluid; adjusting spacings between the light-emitting elements to have a predetermined size by controlling flow of the fluid; placing a package substrate into the fluid, followed by aligning the light-emitting elements with connecting pads of the package substrate so as to correspondingly place the light-emitting elements on the connecting pads; and removing the package substrate with the light-emitting elements from the fluid.
Public/Granted literature
- US20160155906A1 METHOD FOR TRANSFERRING LIGHT-EMITTING ELEMENTS ONTO A PACKAGE SUBSTRATE Public/Granted day:2016-06-02
Information query
IPC分类: