A receptacle comprises a tongue, a plurality of top contacts, a grounding piece and a conductive shell. The tongue is integrated into a printed circuit board. The top contacts are spaced apart along a top row on the tongue and include a pair of top grounding contacts respectively located at both sides of the top row. The grounding piece sequentially has a tail mounted onto the printed circuit board, a base attached to a rear portion of the tongue, a top shielding pad located behind the top contacts and two arms respectively constituting both sides of the tongue. The grounding contacts are respectively located on top surfaces of the two arms. The conductive shell is coupled to the base and surrounds the tongue and the grounding piece.