The present invention relates to a new PTC device having a configuration with which protrusion of solder paste and/or an excess portion of epoxy resin do not adversely affect a jig. Such PTC device 30 includes a PTC member 32 and leads 34 and 36 electrically connected to both sides of the PTC member. The PTC member includes a PTC element 38 and metal electrodes 40 and 42 placed on both sides of the PTC element respectively, and each lead is electrically connected to the metal electrode via an electrically conductive connection portion 50. At least one of the leads 36 has a concave portion which is defined with a bottom portion 44 located adjacently to the metal electrode of the PTC member and a wall portion 46 surrounding the electrically conductive connection portion which connects the leads to the metal electrode.