Invention Grant
- Patent Title: Multiband-support radio-frequency module
- Patent Title (中): 多频段支持射频模块
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Application No.: US14856948Application Date: 2015-09-17
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Publication No.: US09413336B2Publication Date: 2016-08-09
- Inventor: Yuji Takematsu
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP2013-088288 20130419
- Main IPC: H01P5/12
- IPC: H01P5/12 ; H03H11/04 ; H03F3/195 ; H03F3/213 ; H03F3/24 ; H03F1/32 ; H04B15/06 ; H03F3/19 ; H03F3/21 ; H03F3/60 ; H03H9/05

Abstract:
To provide a multiband-support radio-frequency module in which the occurrence of a harmonic signal in an amplifier circuit is suppressed and the output of a radio-frequency signal containing unwanted harmonic components is prevented. A first signal path SL1 and a second signal path SL2 are provided such that they intersect each other at least once in a multilayer substrate 2, as viewed from above. With this configuration, high-output radio-frequency signals output from a first amplifier circuit 31 and a second amplifier circuit 32 can be prevented from interfering with other elements disposed in the multilayer substrate 2. It is thus possible to provide a multiband-support radio-frequency module 1 exhibiting excellent RF characteristics by suppressing the occurrence of harmonic signals in each of the first and second amplifier circuits 31 and 32 and by preventing the output of radio-frequency signals containing unwanted harmonic components.
Public/Granted literature
- US20160006415A1 RADIO-FREQUENCY MODULE Public/Granted day:2016-01-07
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