Invention Grant
- Patent Title: Circuit board for mounting electronic components
- Patent Title (中): 用于安装电子元件的电路板
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Application No.: US14364171Application Date: 2013-01-24
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Publication No.: US09414488B2Publication Date: 2016-08-09
- Inventor: Yuichi Hagiwara
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2012-033351 20120217
- International Application: PCT/JP2013/052118 WO 20130124
- International Announcement: WO2013/121882 WO 20130822
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/34
Abstract:
In a circuit board for mounting electronic components, in which electronic components are to be mounted on its two surfaces by a reflow soldering process, the sizes of lands on the primary and secondary surfaces of the circuit board are set different from each other when chips having the same shape are to be mounted on both the primary and secondary surfaces of the circuit board.
Public/Granted literature
- US20140374152A1 CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENTS Public/Granted day:2014-12-25
Information query
