Invention Grant
US09414490B2 Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability
有权
电路板走线图案，以尽量减少电容器开裂，提高可靠性
- Patent Title: Electrical circuit board trace pattern to minimize capacitor cracking and improve reliability
- Patent Title (中): 电路板走线图案，以尽量减少电容器开裂，提高可靠性
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Application No.: US14206750Application Date: 2014-03-12
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Publication No.: US09414490B2Publication Date: 2016-08-09
- Inventor: Andre P. Willis
- Applicant: HIQ SOLAR, INC.
- Applicant Address: US CA Santa Clara
- Assignee: HIQ SOLAR, INC.
- Current Assignee: HIQ SOLAR, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Vedder Price
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K1/11 ; H05K3/34
Abstract:
A printed wiring board with a component connection pad, such as a solder pad, providing thermal stress compensation for a surface mount circuit component and method for making such a pad. The component connection pad includes opposed groups of multiple conductive fingers that are mutually connected at their far ends and separated at their near ends where they have surfaces for mounting a single surface mount circuit component.
Public/Granted literature
- US20140311791A1 ELECTRICAL CIRCUIT BOARD TRACE PATTERN TO MINIMIZE CAPACITOR CRACKING AND IMPROVE RELIABILITY Public/Granted day:2014-10-23
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