Invention Grant
- Patent Title: Jumper module mounting circuit board and circuit board assembly
- Patent Title (中): 跳线模块安装电路板和电路板组合
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Application No.: US14469675Application Date: 2014-08-27
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Publication No.: US09414491B2Publication Date: 2016-08-09
- Inventor: Takanori Kitajo , Masaki Sugiyama , Masayuki Naohara
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-176530 20130828; JP2014-002152 20140109
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/11 ; H01R12/52 ; H01R29/00 ; H05K3/22 ; H05K1/14 ; H05K1/02 ; H05K1/18

Abstract:
A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module.
Public/Granted literature
- US20150062834A1 JUMPER MODULE MOUNTING CIRCUIT BOARD AND CIRCUIT BOARD ASSEMBLY Public/Granted day:2015-03-05
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