Invention Grant
- Patent Title: Assembly of printed circuit boards
- Patent Title (中): 组装印刷电路板
-
Application No.: US14715943Application Date: 2015-05-19
-
Publication No.: US09414493B2Publication Date: 2016-08-09
- Inventor: Andreas C. Doering , Ralph Heller , Ronald P. Luijten , Martin L. Schmatz
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Keivan Razavi
- Priority: GB1409416.3 20140528
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01R12/52 ; H01R13/24 ; H05K1/14 ; H01R12/73 ; H01R43/26 ; H05K3/36

Abstract:
A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.
Public/Granted literature
- US20150351242A1 ASSEMBLY OF PRINTED CIRCUIT BOARDS Public/Granted day:2015-12-03
Information query