Invention Grant
US09414496B2 Method for a printed circuit board with an array of high density AC coupling/DC blocking capacitors
有权
具有高密度交流耦合/隔直流电容阵列的印刷电路板的方法
- Patent Title: Method for a printed circuit board with an array of high density AC coupling/DC blocking capacitors
- Patent Title (中): 具有高密度交流耦合/隔直流电容阵列的印刷电路板的方法
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Application No.: US14575223Application Date: 2014-12-18
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Publication No.: US09414496B2Publication Date: 2016-08-09
- Inventor: Ricki Dee Williams , Ray Ping-kwan Chan
- Applicant: Oracle International Corporation
- Applicant Address: US CA Redwood City
- Assignee: Oracle International Corporation
- Current Assignee: Oracle International Corporation
- Current Assignee Address: US CA Redwood City
- Agency: Polsinelli PC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H05K1/18 ; H05K1/11 ; H05K1/02 ; H05K3/32 ; H05K3/00 ; H05K3/42

Abstract:
Implementations of the present disclosure involve an apparatus and/or method for a large array of AC coupling/DC blocking capacitors on a printed circuit board (PCB) of a microelectronic circuit. The method provides for the placement of the blocking capacitors (and associated vias) to be placed on/through the PCB in a small area while yielding low crosstalk or interference between the vias. In one particular embodiment, the blocking capacitors are placed on the PCB in an alternating pattern, with a pair of blocking capacitors placed on the top side of the PCB followed by a pair of blocking capacitors on the bottom side of the PCB, and so on. Further, top side capacitor vias may be back-drilled from the bottom side and bottom side capacitor vias may be back-drilled from the top side.
Public/Granted literature
- US20160183373A1 HIGH DENSITY AC COUPLING/DC BLOCKING PIN-FIELD ARRAY Public/Granted day:2016-06-23
Information query
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