Invention Grant
- Patent Title: Method for connecting inter-layer conductors and components in 3D structures
- Patent Title (中): 在3D结构中连接层间导体和部件的方法
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Application No.: US13829921Application Date: 2013-03-14
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Publication No.: US09414501B2Publication Date: 2016-08-09
- Inventor: Ryan B. Wicker , Francisco Medina , Eric MacDonald , Danny W. Muse , David Espalin
- Applicant: Board of Regents, The University of Texas System
- Applicant Address: US TX Austin
- Assignee: Board of Regents, The University of Texas System
- Current Assignee: Board of Regents, The University of Texas System
- Current Assignee Address: US TX Austin
- Agency: Ortiz & Lopez, PLLC
- Agent Kermit D. Lopez; Luis M. Ortiz
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H05K3/32 ; H05K3/10 ; H05K1/02 ; H01L23/00
Abstract:
The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
Public/Granted literature
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