Invention Grant
- Patent Title: Mounting apparatus, component assembly, and electronic device
- Patent Title (中): 安装设备,部件组装和电子设备
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Application No.: US14613017Application Date: 2015-02-03
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Publication No.: US09414505B2Publication Date: 2016-08-09
- Inventor: Wen-Hsiang Hung , Chun-Bao Gu , Hong-Mei Zhang
- Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Wuhan TW New Taipei
- Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Wuhan TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN201510010663 20150109
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/04 ; H05K5/00 ; H05K1/18 ; H05K1/14

Abstract:
An electronic device includes an enclosure, a circuit board mounted in the enclosure, an electronic component attached to the circuit board, an antenna module mounted to the electronic component, and a mounting apparatus configured to mount the antenna module. The mounting apparatus includes a pressing member mounted on the circuit board. The mounting apparatus includes a pressing panel, a pressing block extending from the pressing panel, a positioning piece extending from the pressing panel, and a pressing piece extending from the pressing block. The pressing piece has a back wall. The pressing block presses the electronic component, the pressing panel presses the antenna module, and the back wall and the positioning piece abut against two adjacent sidewalls of the electronic component.
Public/Granted literature
- US20160205795A1 MOUNTING APPARATUS, COMPONENT ASSEMBLY, AND ELECTRONIC DEVICE Public/Granted day:2016-07-14
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