Invention Grant
US09414530B1 Altering thermal conductivity in devices 有权
改变器件中的导热性

Altering thermal conductivity in devices
Abstract:
Described are features to control distribution of thermal energy by structures such as portions of a case of a device. Various patterns of thermally conductive or insulating substances alter the thermal conductivity of a structure and provide selective directional distribution of thermal energy away from a hot spot caused by operation of a device component. The features result in a predetermined distribution of thermal energy across one or more structures, and may increase thermal uniformity.
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