Invention Grant
- Patent Title: Altering thermal conductivity in devices
- Patent Title (中): 改变器件中的导热性
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Application No.: US13718661Application Date: 2012-12-18
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Publication No.: US09414530B1Publication Date: 2016-08-09
- Inventor: John Avery Howard , David Eric Peters , Ross Kenneth Thayer
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Lindauer Law, PLLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H01L23/34 ; H01L23/373 ; G06F1/20

Abstract:
Described are features to control distribution of thermal energy by structures such as portions of a case of a device. Various patterns of thermally conductive or insulating substances alter the thermal conductivity of a structure and provide selective directional distribution of thermal energy away from a hot spot caused by operation of a device component. The features result in a predetermined distribution of thermal energy across one or more structures, and may increase thermal uniformity.
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