Invention Grant
- Patent Title: Packaged semiconductor sensor device with lid
- Patent Title (中): 带盖的封装半导体传感器装置
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Application No.: US14559921Application Date: 2014-12-04
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Publication No.: US09416002B2Publication Date: 2016-08-16
- Inventor: Nan Xu , Xingshou Pang , Xuesong Xu
- Applicant: Nan Xu , Xingshou Pang , Xuesong Xu
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles E. Bergere
- Priority: CN201410520628 20140728
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81C1/00 ; B81B7/00
Abstract:
A method for assembling a packaged semiconductor device includes mounting a pressure-sensing die onto a die paddle of a metal lead frame. A pressure-sensitive gel is dispensed into a recess of a lid, and the lead frame is mated with the lid such that the pressure-sensing die is immersed in the pressure-sensitive gel within the recess of the lid.
Public/Granted literature
- US20160023894A1 PACKAGED SEMICONDUCTOR SENSOR DEVICE WITH LID Public/Granted day:2016-01-28
Information query
IPC分类:
